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Output details

13 - Electrical and Electronic Engineering, Metallurgy and Materials

University of Greenwich

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Article title

Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

Type
D - Journal article
Title of journal
Materials & Design
Article number
-
Volume number
30
Issue number
10
First page of article
4502
ISSN of journal
0261-3069
Year of publication
2009
Number of additional authors
4
Additional information

The research was part of a University funded PhD study carried out (between 2004 and 2009) by Dr Mallik at the Electronics Manufacturing Engineering Research Lab in the School of Engineering, University of Greenwich. The project benefited from the supply of solder paste materials from Henkel (UK) Ltd. The findings, as outlined in the paper, were extremely valuable for Henkel who have exploited those to improve their quality control mechanism for solder pastes. The paper which promotes the use of lead-free solder will ultimately benefit people’s health and environment by reducing lead contamination in landfills and in drinking water.

Interdisciplinary
-
Cross-referral requested
-
Research group
1 - Centre for Numerical Modelling and Process Analysis (CNMPA)
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-