Output details
13 - Electrical and Electronic Engineering, Metallurgy and Materials
University of Greenwich
Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications
The research was part of a University funded PhD study carried out (between 2004 and 2009) by Dr Mallik at the Electronics Manufacturing Engineering Research Lab in the School of Engineering, University of Greenwich. The project benefited from the supply of solder paste materials from Henkel (UK) Ltd. The findings, as outlined in the paper, were extremely valuable for Henkel who have exploited those to improve their quality control mechanism for solder pastes. The paper which promotes the use of lead-free solder will ultimately benefit people’s health and environment by reducing lead contamination in landfills and in drinking water.