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Micro-nondestructive evaluation of microelectronics using three-dimensional acoustic imaging

This paper introduces holographic-like three-dimensional acoustic imaging for micro-non-destructive evaluation of microelectronics - EPSRC grant EP/G004358/1. This new technique of sparse signal representation based acoustic time-frequency domain imaging overcomes the wavelength limitation imposed upon axial resolution, enabling the detection of ultra-thin interface slices. Collaboration with Fraunhofer IZM, who provided access to some of the world’s first embedded die microelectronic packages, enabled the technique to provide 3D acoustic data from these. This experiment, presented in the paper, demonstrates that the method could resolve closely spaced features that were undetectable via conventional acoustic imaging.