Output details
16 - Architecture, Built Environment and Planning
University of Bath
Article title
Creep response of thixotropic ambient temperature cure adhesives measured by DMTA in static tension and shear
Type
D - Journal article
Title of journal
International Journal of Adhesion and Adhesives
Article number
-
Volume number
31
Issue number
6
First page of article
575
ISSN of journal
0143-7496
Year of publication
2011
Number of additional authors
3
Additional information
This paper is the first to report on the use of a Dynamic Mechanical Thermal Analyser (DMTA) in static mode to evaluate the creep properties of thixotropic room temperature cure epoxy adhesives. A unique design of laminated shear specimen is described.
Interdisciplinary
-
Cross-referral requested
-
Research group
B - Innovative Construction Materials
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-