Output details
15 - General Engineering
Heriot-Watt University (joint submission with University of Edinburgh)
Article title
Electrical Test Structure for the Measurement of Hermeticity in Electronic and MEMS Packages with Small Cavity Volumes
Type
D - Journal article
Title of journal
IEEE Transactions on Semiconductor Manufacturing
Article number
-
Volume number
26
Issue number
3
First page of article
281
ISSN of journal
0894-6507
Year of publication
2013
URL
-
Number of additional authors
5
Additional information
This paper presents the first realisation of a novel electromechanical sensor for the detection of hermeticity in low-cavity-volume packages with real-time detection of leak rates 100 times more sensitive than the limit of traditional helium fine leak test. The in-situ structure can be used as a back-end hermeticity test structure during manufacturing or as an on-line monitoring structure during device operation.
Interdisciplinary
-
Cross-referral requested
-
Research group
A - Manufacturing & Materials
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-
