Output details
15 - General Engineering
University of Southampton
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Output 0 of 0 in the submission
Article title
Accurate characterization of wafer bond toughness with the double cantilever specimen
Type
D - Journal article
Title of journal
Journal of Applied Physics
Article number
-
Volume number
103
Issue number
1
First page of article
013514
ISSN of journal
0021-8979
Year of publication
2008
Number of additional authors
1
Additional information
Significance of output:
Paper co-authored with Prof. Turner at University of Wisconsin (he has since moved to U.Penn) USA. Presents definitive analysis of a widely used (in industry and academia), but hitherto incorrectly analyzed, test method for determining wafer bond toughness. Wafer bonding is a key technology for Microelectromechanical systems and 3-D interconnection strategies for next generation semiconductor devices. Errors of up to 20% were identified in the previously used data reduction method.
Interdisciplinary
-
Cross-referral requested
-
Research group
None
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-