Output details
12 - Aeronautical, Mechanical, Chemical and Manufacturing Engineering
University of Greenwich
Finite-element simulation of stress intensity factors in solder joint intermetallic compounds
Originality is the use of a fracture mechanics approach to predict crack behaviour of intermetallic compounds (IMC’s) found in solder joints. This is the first time such a numerical study has been undertaken in comparing behaviour of IMC’s in both Tin-Lead and Lead-Free Solders. This is significant as tin-lead solders are now banned under ROHS EU Legislation. Led onto a new project funded US Government (H94003-04-D-003-0056) worth US$350,000, to develop physics-of-failure models for electronic components in aerospace environments for companies such as Cassidian and Selex Galileo (Prof John Roulston, Ex CTO Selex-Galileo, jfroulston@yahoo.co.uk)