Output details
11 - Computer Science and Informatics
University of Greenwich
Modelling methodology for thermal analysis of hot solder dip process
Funded through a US Government Grant (H94003-04-D-003-0056/10178928), this is the first time a detailed modelling approach has been developed and validated to identify optimal process conditions for a robotic controlled hot solder dip process that will ensure leaded electronic components are reliable in safety critical applications. Provides our industrial partners with a novel qualification process for these components with potential costs savings of £100,000 per component (Paul Stewart, Lead Engineer, Selex-ES, paul.stewart2@selex-es.com). Work has led onto further grant (H94003-04-D-003-0056/ 10198575) to investigate unleaded components such as ball grid arrays.