Output details
11 - Computer Science and Informatics
University of Bristol
Output title
Compact modelling of Through-Silicon Vias (TSVs) in three-dimensional (3-D) integrated circuits
Type
E - Conference contribution
Name of conference/published proceedings
IEEE International Conference on 3D System Integration
Volume number
-
Issue number
-
First page of article
1
ISSN of proceedings
-
Year of publication
2009
Number of additional authors
4
Additional information
<01> This paper, which provides a complete set of models for physical modelling of through-silicon vias in 3-D Integrated Circuits, was developed within the context of a European project (ELITE) [ for details see Pamanwa-2].
It was later incorporated in design exploration exercises at Numonyx Inc, a leading European semiconductor company dealing in flash memory prior to its acquisition by Micron [for contact see audit file], a world leading memory manufacturer.
Interdisciplinary
-
Cross-referral requested
-
Research group
D - Microelectronics Group
Citation count
2
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-
