Output details

Modelling methodology for thermal analysis of hot solder dip process

Funded through the US Government Grant ((H94003-04-D-003-0056) and supported by Selex Electronic Systems, Rolls Royce, Cassidian (an EADS company) and General Dynamics. The novel virtual qualification approach of electronics components subjected to a new robotised post-manufacturing process, developed and demonstrated at University of Greenwich and validated at Micross Components Ltd., enables the manufacturers of high-reliability equipment to substitute expensive experimental qualification programmes thus realising typical cost savings of £100,000 per component (paul.stewart2@selex-es.com – Paul Stewart, Lead Engineer, Selex Electronic Systems). This work has guided the process optimisation at Micross and has resulted in alteration of process parameters that made the process compatible with manufacturers’ requirements in terms of temperature change rates (Peter.Tollafield@micross.com – Micross Semiconductors Limited). This is a major impact that makes the use of this process possible and customisable for wide range of components. This capability was not present prior to this work.