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An automated ultrasonic inspection approach for flip chip solder joint assessment

This paper presents results from EPSRC funded project (EP/H03014x/1 (IeMRC)). A new method for automated solder joint assessment was reported for the first time. This novel approach extracts solder joint’s features from ultrasound images to enable automated solder joint assessment. The work is important for failure analysis as it offers improved discrimination between a healthy and a fractured joint in previously difficult to assess applications. A new joint classification idea also contributed a significant advance to determining an electronic product’s integrity. This helps the NDE community and is being adopted in the failure analysis labs of Delphi Electronics and Safety.