Output details
13 - Electrical and Electronic Engineering, Metallurgy and Materials
University College London
Radiation and Bound Mode Propagation in Rectangular Multimode Dielectric Channel Waveguides with Sidewall Roughness
Work uncovered the contribution of roughness on waveguide loss for board-to-board interconnections, an important study within the Storlite project (GR/S28136/01). Work in Storlite including this paper has led to the successfully commercialised patent US7,936,953B2 and to the £1.3M IeMRC flagship project “Integrated Optical and Electronic Interconnect PCB Manufacturing” with Papakonstantinou as named researcher and the participation of eight companies including BAE, Corning, Xyratex, Cadence, IBM Zurich and NPL. Invited/plenary talks given at international conferences including IEEE Interconnections within High-Speed Digital Systems (HSDS) 2008, PIERS 2008, SPIE Photonics West 2009. Papakonstantinou invited to join the committee of IEEE HSDS in 2008.