Output details
11 - Computer Science and Informatics
University of Greenwich
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Article title
Modelling methodology for thermal analysis of hot solder dip process
Type
D - Journal article
Title of journal
Microelectronics Reliability
Article number
-
Volume number
53
Issue number
8
First page of article
1055
ISSN of journal
0026-2714
Year of publication
2013
Number of additional authors
8
Additional information
Funded through a US Government Grant (H94003-04-D-003-0056/10178928), this is the first time a detailed modelling approach has been developed and validated to identify optimal process conditions for a robotic controlled hot solder dip process that will ensure leaded electronic components are reliable in safety critical applications. Provides our industrial partners with a novel qualification process for these components with potential costs savings of £100,000 per component (Paul Stewart, Lead Engineer, Selex-ES, paul.stewart2@selex-es.com). Work has led onto further grant (H94003-04-D-003-0056/ 10198575) to investigate unleaded components such as ball grid arrays.
Interdisciplinary
-
Cross-referral requested
-
Research group
1 - Computational Mechanics & Reliability Group
Citation count
0
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-
