Output details
13 - Electrical and Electronic Engineering, Metallurgy and Materials
Queen's University Belfast
Return to search
Output 0 of 0 in the submission
Article title
Optimization of an open-ended microwave oven for microelectronics packaging
Type
D - Journal article
Title of journal
IEEE Transactions on Microwave Theory and Techniques
Article number
4657397
Volume number
56
Issue number
11
First page of article
2635
ISSN of journal
0018-9480
Year of publication
2008
URL
-
Number of additional authors
6
Additional information
This work established a novel technology for the rapid curing during microelectronics packaging using an original microwave oven. The oven has an open wall allowing the target to be rapidly introduced, yet is electromagnetically shielded, thus providing power efficiency while addressing health concerns. The work is the subject of UK patent filing (GB0819335.1) and has won three stages of funding, twice by IeMRC and also EU (FP7-SME-2007-2/218350-2). Through the FP7 project and partnership with Fraunhofer institute as well as various SMEs, the oven has now been integrated with a pick and place robot and commercial opportunities are currently being explored.
Interdisciplinary
-
Cross-referral requested
-
Research group
A - High Frequency Electronics (HFE)
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-
