Output details
13 - Electrical and Electronic Engineering, Metallurgy and Materials
Queen's University Belfast
Optimization of an open-ended microwave oven for microelectronics packaging
This work established a novel technology for the rapid curing during microelectronics packaging using an original microwave oven. The oven has an open wall allowing the target to be rapidly introduced, yet is electromagnetically shielded, thus providing power efficiency while addressing health concerns. The work is the subject of UK patent filing (GB0819335.1) and has won three stages of funding, twice by IeMRC and also EU (FP7-SME-2007-2/218350-2). Through the FP7 project and partnership with Fraunhofer institute as well as various SMEs, the oven has now been integrated with a pick and place robot and commercial opportunities are currently being explored.