Output details
13 - Electrical and Electronic Engineering, Metallurgy and Materials
Loughborough University
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Output 0 of 0 in the submission
Article title
Diffusivity variation in Electromigration failure
Type
D - Journal article
Title of journal
Microelectronics Reliability
Article number
-
Volume number
52
Issue number
9-10
First page of article
1960
ISSN of journal
0026-2714
Year of publication
2012
URL
-
Number of additional authors
0
Additional information
This work led to an approach from Prof Chee Lip Gan {clgan@ntu.edu.sg } at NTU (Singapore) and Meng Keong Lim (X060016@e.ntu.edu.sg) from Globalfoundries, the world's second largest independent semiconductor foundry. This collaboration, which has produced an initial output presented at ESREF 23 and a paper published in Microelectronics Reliability (http://dx.doi.org/10.1016/j.microrel.2013.07.017), continues.
Interdisciplinary
-
Cross-referral requested
-
Research group
None
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-