For the current REF see the REF 2021 website REF 2021 logo

Output details

13 - Electrical and Electronic Engineering, Metallurgy and Materials

Loughborough University

Return to search Previous output Next output
Output 0 of 0 in the submission
Article title

Diffusivity variation in Electromigration failure

Type
D - Journal article
Title of journal
Microelectronics Reliability
Article number
-
Volume number
52
Issue number
9-10
First page of article
1960
ISSN of journal
0026-2714
Year of publication
2012
URL
-
Number of additional authors
0
Additional information

This work led to an approach from Prof Chee Lip Gan {clgan@ntu.edu.sg } at NTU (Singapore) and Meng Keong Lim (X060016@e.ntu.edu.sg) from Globalfoundries, the world's second largest independent semiconductor foundry. This collaboration, which has produced an initial output presented at ESREF 23 and a paper published in Microelectronics Reliability (http://dx.doi.org/10.1016/j.microrel.2013.07.017), continues.

Interdisciplinary
-
Cross-referral requested
-
Research group
None
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-