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13 - Electrical and Electronic Engineering, Metallurgy and Materials

Loughborough University

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Article title

Analysis of critical-length data from Electromigration failure studies

Type

D - Journal article

DOI

10.1016/j.microrel.2011.06.036

Title of journal

Microelectronics Reliability

Article number

Volume number

Issue number

9-11

First page of article

1568

ISSN of journal

0026-2714

Year of publication

2011

URL

Number of additional authors

Additional information

International recognition from a group working jointly between Bordeaux IMS and Hannover led by Dr Kirsten Weige-Zaage (University of Hannover, Germany (weide-zaage@lfi.uni-hannover.de) has led to collaboration with that group. Subsequent work seeks to explain the experimental results on migration of intermetallics in solder ball grid array microbumps, obtained at the IMS Laboratory in the University of Bordeaux (France), through detailed simulation of the processes involved.

Interdisciplinary

Cross-referral requested

Research group

None

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract