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Output details

16 - Architecture, Built Environment and Planning

University of Bath

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Output 26 of 100 in the submission

Article title

Creep response of thixotropic ambient temperature cure adhesives measured by DMTA in static tension and shear

Type

D - Journal article

DOI

10.1016/j.ijadhadh.2011.05.008

Title of journal

International Journal of Adhesion and Adhesives

Article number

Volume number

Issue number

First page of article

575

ISSN of journal

0143-7496

Year of publication

2011

URL

http://dx.doi.org/10.1016/j.ijadhadh.2011.05.008

Number of additional authors

Additional information

This paper is the first to report on the use of a Dynamic Mechanical Thermal Analyser (DMTA) in static mode to evaluate the creep properties of thixotropic room temperature cure epoxy adhesives. A unique design of laminated shear specimen is described.

Interdisciplinary

Cross-referral requested

Research group

B - Innovative Construction Materials

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract