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Output details

15 - General Engineering

University of Warwick

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Output 271 of 344 in the submission

Article title

Si/SiC bonded wafer: a route to carbon free SiO2 on SiC

Type

D - Journal article

DOI

10.1063/1.3099018

Title of journal

Applied Physics Letters

Article number

103510

Volume number

Issue number

First page of article

ISSN of journal

0003-6951

Year of publication

2009

URL

Number of additional authors

Additional information

The work was funded as part of a TSB industrial collaborative project called “Intrinsic” with Semelab plc., Pure Wafer Ltd, IQE Ltd, Surface Technology Systems plc. and Trikon Technologies plc. The work resulted in a patent (Application No. GB20100015595, contact Mr Adrian Shipley - Adrian.Shipley@ge.com). The patent has now been taken up by GE Aviation in the UK and US for commercialisation.

Interdisciplinary

Cross-referral requested

Research group

None

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract