Output details

Through lifetime monitoring of solder joints using acoustic micro imaging

This work, supported by EPSRC EP/H03014x/1 (IeMRC), evaluated the design and application of a novel acoustic micro-imaging (AMI) inspection technique to monitor solder joints' through-lifetime performance. A new idea of collecting AMI samples throughout a product's lifetime proved successful. During accelerated thermal cycling tests on flip-chip test boards, solder joint parameters in acoustic images were extracted by custom signal processing techniques, measured and analysed. This enabled failure tracking, due to cracks between the solder bump and chip interface, to be uniquely achieved. The feasibility of the techniques was demonstrated, and has been adopted by Delphi Electronics and Safety.