Output details
12 - Aeronautical, Mechanical, Chemical and Manufacturing Engineering
University of Greenwich
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Article title
Finite-element simulation of stress intensity factors in solder joint intermetallic compounds
Type
D - Journal article
Title of journal
IEEE Transactions on Device and Materials Reliability
Article number
-
Volume number
9
Issue number
1
First page of article
40
ISSN of journal
1530-4388
Year of publication
2009
Number of additional authors
3
Additional information
Originality is the use of a fracture mechanics approach to predict crack behaviour of intermetallic compounds (IMC’s) found in solder joints. This is the first time such a numerical study has been undertaken in comparing behaviour of IMC’s in both Tin-Lead and Lead-Free Solders. This is significant as tin-lead solders are now banned under ROHS EU Legislation. Led onto a new project funded US Government (H94003-04-D-003-0056) worth US$350,000, to develop physics-of-failure models for electronic components in aerospace environments for companies such as Cassidian and Selex Galileo (Prof John Roulston, Ex CTO Selex-Galileo, jfroulston@yahoo.co.uk)
Interdisciplinary
-
Cross-referral requested
-
Research group
1 - Centre for Numerical Modelling and Process Analysis
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-
