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Output details

13 - Electrical and Electronic Engineering, Metallurgy and Materials

University of the West of Scotland

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Article title

The effect of PECVD plasma decomposition on the wettability and dielectric constant changes in silicon modified DLC films for potential MEMS and low stiction applications

Type
D - Journal article
Title of journal
AIP Advances
Article number
-
Volume number
2
Issue number
3
First page of article
032128
ISSN of journal
21583226
Year of publication
2012
URL
-
Number of additional authors
2
Additional information

This paper demonstrates the suitability of using combined optical probes like Raman spectroscopy, Ellipsometry and Plasma chemistry during deposition to understand and control stiction and nano-tribology in Micro-electromechanical (MEMS) and Nano-devices based on Si-DLC thin films. The traditional method of obtaining tribological information is not easily applicable on the nano-scale where the Van der Waals force dominates surface interactions. This is an extension of previous work, A.A. Ogwu et al, Acta Materialia (2003), Physica B (1999), J.Phys.D (1999).The link between the chemical surface energy probe and optical probes through the Hamaker constant is explored to gauge the stiction process.

Interdisciplinary
-
Cross-referral requested
-
Research group
None
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-