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Output details

13 - Electrical and Electronic Engineering, Metallurgy and Materials

University of Greenwich

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Output 22 of 31 in the submission

Article title

Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly

Type

D - Journal article

DOI

10.1016/j.jmatprotec.2008.09.013

Title of journal

Journal of Materials Processing Technology

Article number

Volume number

209

Issue number

First page of article

3923

ISSN of journal

0924-0136

Year of publication

2008

URL

http://gala.gre.ac.uk/1612/

Number of additional authors

Additional information

The paper disseminates the findings from a collaborative research work between University Tunku Abdul Rahman (UTAR), Malaysia, University of Greenwich, UK and Henkel (UK) Ltd and was partly funded from an EPSRC funded project (called MAT21). The experimental part of the study was carried out at the Electronics Manufacturing Research Lab, University of Greenwich and materials were supplied by Henkel (UK) Ltd. The findings were very significant for the industrial partner who used those to engineer their solder pastes and conductive adhesives. The success of this project led to a PhD project supported by the industrial partner.

Interdisciplinary

Cross-referral requested

Research group

1 - Centre for Numerical Modelling and Process Analysis (CNMPA)

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract