Output details
15 - General Engineering
Heriot-Watt University (joint submission with University of Edinburgh)
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Output 0 of 0 in the submission
Article title
Design, fabrication, and characterization of flip-chip bonded microinductors
Type
D - Journal article
Title of journal
IEEE Transactions on Magnetics
Article number
5170214
Volume number
45
Issue number
8
First page of article
3055
ISSN of journal
0018-9464
Year of publication
2009
URL
-
Number of additional authors
1
Additional information
-
Interdisciplinary
-
Cross-referral requested
-
Research group
B - Sensors, Signals & Systems
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-