Output details
13 - Electrical and Electronic Engineering, Metallurgy and Materials
University of Greenwich
Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly
The paper disseminates the findings from a collaborative research work between University Tunku Abdul Rahman (UTAR), Malaysia, University of Greenwich, UK and Henkel (UK) Ltd and was partly funded from an EPSRC funded project (called MAT21). The experimental part of the study was carried out at the Electronics Manufacturing Research Lab, University of Greenwich and materials were supplied by Henkel (UK) Ltd. The findings were very significant for the industrial partner who used those to engineer their solder pastes and conductive adhesives. The success of this project led to a PhD project supported by the industrial partner.