Output details
12 - Aeronautical, Mechanical, Chemical and Manufacturing Engineering
University of Wolverhampton
Article title
Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly
Type
D - Journal article
Title of journal
Journal of Materials Processing Technology
Article number
-
Volume number
209
Issue number
8
First page of article
3923
ISSN of journal
09240136
Year of publication
2009
URL
-
Number of additional authors
4
Additional information
-
Interdisciplinary
-
Cross-referral requested
-
Research group
E - Engineering Research Group
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-