Output details

12 - Aeronautical, Mechanical, Chemical and Manufacturing Engineering

Output 38 of 48 in the submission

Article title

Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations

Type

D - Journal article

DOI

Title of journal

Microelectronics Reliability

Article number

Volume number

Issue number

First page of article

2731

ISSN of journal

00262714

Year of publication

2012

URL

Number of additional authors

Additional information

Interdisciplinary

Cross-referral requested

Research group

E - Engineering Research Group

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract