Output details

12 - Aeronautical, Mechanical, Chemical and Manufacturing Engineering

Output 3 of 48 in the submission

Article title

A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits

Type

D - Journal article

DOI

Title of journal

Microelectronic Engineering

Article number

Volume number

Issue number

First page of article

1610

ISSN of journal

01679317

Year of publication

2011

URL

Number of additional authors

Additional information

Interdisciplinary

Yes

Cross-referral requested

Research group

E - Engineering Research Group

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract