Output details

12 - Aeronautical, Mechanical, Chemical and Manufacturing Engineering

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Article title

The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes

Type

D - Journal article

DOI

Title of journal

Materials & Design

Article number

Volume number

Issue number

First page of article

1056

ISSN of journal

02613069

Year of publication

2010

URL

Number of additional authors

Additional information

Interdisciplinary

Cross-referral requested

Research group

E - Engineering Research Group

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract