Output details

12 - Aeronautical, Mechanical, Chemical and Manufacturing Engineering

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Article title

Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly

Type

D - Journal article

DOI

Title of journal

Journal of Materials Processing Technology

Article number

Volume number

209

Issue number

First page of article

3923

ISSN of journal

09240136

Year of publication

2009

URL

Number of additional authors

Additional information

Interdisciplinary

Cross-referral requested

Research group

E - Engineering Research Group

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract