Output details
12 - Aeronautical, Mechanical, Chemical and Manufacturing Engineering
University of Wolverhampton
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Output 0 of 0 in the submission
Article title
Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations
Type
D - Journal article
Title of journal
Microelectronics Reliability
Article number
-
Volume number
52
Issue number
11
First page of article
2731
ISSN of journal
00262714
Year of publication
2012
URL
-
Number of additional authors
1
Additional information
-
Interdisciplinary
-
Cross-referral requested
-
Research group
E - Engineering Research Group
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-