Output details
12 - Aeronautical, Mechanical, Chemical and Manufacturing Engineering
University of Wolverhampton
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Article title
Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process
Type
D - Journal article
Title of journal
Materials & Design
Article number
-
Volume number
32
Issue number
6
First page of article
3189
ISSN of journal
02613069
Year of publication
2011
URL
-
Number of additional authors
2
Additional information
-
Interdisciplinary
Yes
Cross-referral requested
-
Research group
E - Engineering Research Group
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-