Output details

12 - Aeronautical, Mechanical, Chemical and Manufacturing Engineering

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Article title

High temperature reliability of lead-free solder joints in a flip chip assembly

Type

D - Journal article

DOI

Title of journal

Journal of Materials Processing Technology

Article number

Volume number

212

Issue number

First page of article

471

ISSN of journal

09240136

Year of publication

2012

URL

Number of additional authors

Additional information

Interdisciplinary

Yes

Cross-referral requested

Research group

E - Engineering Research Group

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract