Output details
12 - Aeronautical, Mechanical, Chemical and Manufacturing Engineering
University of Wolverhampton
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Article title
Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling
Type
D - Journal article
Title of journal
Computational Materials Science
Article number
-
Volume number
65
Issue number
-
First page of article
470
ISSN of journal
09270256
Year of publication
2012
URL
-
Number of additional authors
1
Additional information
-
Interdisciplinary
Yes
Cross-referral requested
-
Research group
E - Engineering Research Group
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-