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Output details

12 - Aeronautical, Mechanical, Chemical and Manufacturing Engineering

University of Greenwich

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Output 2 of 36 in the submission
Article title

A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects

Type
D - Journal article
Title of journal
Microelectronics Reliability
Article number
-
Volume number
50
Issue number
9-Nov
First page of article
1706
ISSN of journal
0026-2714
Year of publication
2010
Number of additional authors
5
Additional information

The modelling work, undertaken by Greenwich, optimised the design of novel test equipment, developed at the National Physical Laboratory, to predict reliability of micro-solder joints under vibration loading. The ability to assess the reliability of lead-free solders is important to enable industry to address EU Legislation such as Reduction of Hazrdous Substance (RoHS) which bans lead-solders in consumer electronic products. Equipment is now available and work was widely disseminated to international companies through the National Physical Laboratory Industrial Advisory Board (Chris Hunt, Head of Interconnection Team, National Physical Laboratory, Chris.Hunt@npl.co.uk).

Interdisciplinary
-
Cross-referral requested
-
Research group
1 - Centre for Numerical Modelling and Process Analysis
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-