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Output details

15 - General Engineering

University of Nottingham

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Output 262 of 524 in the submission

Article title

Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

Type

D - Journal article

DOI

10.1016/j.actamat.2010.10.053

Title of journal

Acta Materialia

Article number

Volume number

Issue number

First page of article

1198

ISSN of journal

1359-6454

Year of publication

2011

URL

Number of additional authors

Additional information

Fundamental studies informing the choice of joining technologies for power electronic modules and being applied in application-specific EPSRC research projects: “Vehicle Electrical Systems Integration” (EP/I013636/1); “Transformation of the Top and Tail of Energy Netowrks” EP/I031707/1).

Interdisciplinary

Cross-referral requested

Research group

None

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract