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15 - General Engineering

University of Oxford

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Article title

From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy

Type

D - Journal article

DOI

10.1115/1.4004657

Title of journal

Journal of Electronic Packaging

Article number

Volume number

133

Issue number

First page of article

031008

ISSN of journal

1043-7398

Year of publication

2011

URL

Number of additional authors

Additional information

This research was a formal partnership I developed between University of Limerick and Hewlett Packard, USA. The research provides novel, and rapid, methodologies for understanding and optimising energy efficiency in datacentres and telecom rooms. This research allowed a Multi-Scale Energy Modelling tool help HP customers predict energy costs through software developed by HP, see http://www.hpl.hp.com/news/2011/jul-sep/sustainability.html. The model was licensed to Nokia Siemens Networks (NSN) for telecom rooms and led to energy efficiency projects funded by NSN. My PhD student, Breen, received the ASME EPPD Student Member of the Year Award in 2012 based on this work.

Interdisciplinary

Cross-referral requested

Research group

G - Thermodynamics and Fluids

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract