Output details
15 - General Engineering
University of Nottingham
Article title
Kinetics of Ag3Sn growth in Ag-Sn-Ag system during transient liquid phase soldering process
Type
D - Journal article
Title of journal
Acta Materialia
Article number
-
Volume number
58
Issue number
9
First page of article
3429
ISSN of journal
1359-6454
Year of publication
2010
URL
-
Number of additional authors
2
Additional information
The combination of low processing temperature and high remelt temperature is attractive for creating power semiconductor packaging solutions. The knowledge and techniques described are now part of the portfolio of module assembly processes at Dynex Semiconductor (Steve_Jones@dynexsemi.com).
Interdisciplinary
-
Cross-referral requested
-
Research group
None
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-
