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13 - Electrical and Electronic Engineering, Metallurgy and Materials

Loughborough University

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Output 45 of 131 in the submission

Article title

Diffusivity variation in Electromigration failure

Type

D - Journal article

DOI

10.1016/j.microrel.2012.06.057

Title of journal

Microelectronics Reliability

Article number

Volume number

Issue number

9-10

First page of article

1960

ISSN of journal

0026-2714

Year of publication

2012

URL

Number of additional authors

Additional information

This work led to an approach from Prof Chee Lip Gan {clgan@ntu.edu.sg } at NTU (Singapore) and Meng Keong Lim (X060016@e.ntu.edu.sg) from Globalfoundries, the world's second largest independent semiconductor foundry. This collaboration, which has produced an initial output presented at ESREF 23 and a paper published in Microelectronics Reliability (http://dx.doi.org/10.1016/j.microrel.2013.07.017), continues.

Interdisciplinary

Cross-referral requested

Research group

None

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract