Output details
13 - Electrical and Electronic Engineering, Metallurgy and Materials
University of Sheffield : B - Materials Science and Engineering
Bottom-up Nanoconstruction by the Welding of Individual Metallic Nanoobjects Using Nanoscale Solder
Shrinkage of electronic components means that new methods of nanojoining are required to integrate nanocomponents with electrodes. This paper presents a new breakthrough concept for site-specific joining of electronic components by electrical deposition of nanoscale solder balls. The novel nanosoldering method is clearly demonstrated, achieving the smallest conductive solder joints to date. This work has since influenced the work of over 25 international research groups, been highlighted on >50 websites and newspapers (e.g. http://www.nanowerk.com/spotlight/spotid=8844.php, http://phys.org/news149774354.html), filed as an international patent (PCT/GB2009/050395), and led to a Chinese Government Collaboration Grant with visiting Professor Appointment (Lanzhou).
