Output details
13 - Electrical and Electronic Engineering, Metallurgy and Materials
University of Greenwich
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Article title
Transfer of functional ceramic thin films using a thermal release process
Type
D - Journal article
Title of journal
Advanced Materials
Article number
-
Volume number
23
Issue number
10
First page of article
1252
ISSN of journal
0935-9648
Year of publication
2011
Number of additional authors
5
Additional information
Work reports a novel Nano electronic thin film transfer technique which was described as ‘revolutionary’ by the journal peer reviewer and hence published by Advanced Material with impact factor of 12.813. Greenwich work focused on modelling the thermal release process, the results were proved to be important in identifying the main driving force of the release process and the release mechanism. This work was also awarded Outstanding Paper Prize at 11th IEEE Conference on Electronic Packaging Technology & High Density Packaging in China in 2010.
Interdisciplinary
-
Cross-referral requested
-
Research group
1 - Centre for Numerical Modelling and Process Analysis (CNMPA)
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-
