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13 - Electrical and Electronic Engineering, Metallurgy and Materials

University of Greenwich

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Article title

Optimization of an open-ended microwave oven for microelectronics packaging

Type

D - Journal article

DOI

10.1109/TMTT.2008.2005925

Title of journal

IEEE Transactions on Microwave Theory and Techniques

Article number

Volume number

Issue number

First page of article

2635

ISSN of journal

0018-9480

Year of publication

2008

URL

http://gala.gre.ac.uk/1217/

Number of additional authors

Additional information

Paper reports on a world first, the use of micro-engineered microwave oven for the localised curing of polymers in electronics packaging. The significance of this output is (i) dramatic reduction in the cost for the assembly of electronics components onto printed circuits and (ii) cost effective route to rework of components and recovery of semiconductor devices. Greenwich supported design work with multi-physics models. Work presented led to the EU project FAMOBS (EU: FP7-SME-2007-2), involving collaboration with SME’s throughout Europe - Paul Jarvie (National Microelectronics Institute), paul.jarvie@nmi.org.uk). Output also led to recent EU project NextFactory (Grant Number 608995)

Interdisciplinary

Cross-referral requested

Research group

1 - Centre for Numerical Modelling and Process Analysis (CNMPA)

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract