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Preparation, Characterization and Scanned Conductance Microscopy Studies of DNA-Templated One-Dimensional Copper Nanostructures

This work was undertaken as part of a project sponsored by Intel (Bernie Capraro, Intel +353 1 6064228) into new methods to fabricate copper wires in microchips. These are the dominant technology of VLSI interconnects but are currently fabricated by an expensive top down process that requires many steps including high resolution lithography. The fabricated wires are significantly thinner than any other copper wires published in the literature and represent the first initial evidence of conductance properties of copper at very thin dimensions – in particular the role of surface scattering and domain boundary effects.