Output details
13 - Electrical and Electronic Engineering, Metallurgy and Materials
University of the West of Scotland
Characterization of an epoxy filler for piezocomposites compatible with microfabrication processes [Correspondence]
This paper communicates a significant departure from established practice. The planarization of two dissimilar materials for photolithography is novel and opens up an opportunity to delineate small features much later in the manufacturing process. The choice of the epoxy filler described is important as it offers unparalleled resistance to the processing environment. Electrode patterning also follows an unconventional route. The significance of this work is to highlight a new methodology in the fabrication of ultrasonic arrays which is not possible using conventional methods. The process described has been widely adopted by other research institutions
