Output details
15 - General Engineering
Brunel University London
Article title
A time–strain monitoring system fabricated via offset lithographic printing
Type
D - Journal article
Title of journal
Smart Materials and Structures
Article number
015015
Volume number
18
Issue number
1
First page of article
-
ISSN of journal
1361-665X
Year of publication
2008
Number of additional authors
5
Additional information
Strain-sensitive structures were fabricated via the Conductive Lithographic Film circuit printing process. These structures were employed in forming an electronic smart packaging system, capable of detecting 'rough handling' of items during transit. Several patents, including a granted U.S. Patent, had previously been obtained in respect of the Conductive Lithographic Film process, and have been licensed to three companies.
Interdisciplinary
-
Cross-referral requested
-
Research group
None
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-
