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Output details

15 - General Engineering

University of Warwick

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Output 162 of 344 in the submission

Article title

Investigation of strain engineering in FinFETs comprising experimental analysis and numerical simulations

Type

D - Journal article

DOI

10.1109/TED.2011.2119320

Title of journal

IEEE Transactions on Electron Devices

Article number

Volume number

Issue number

First page of article

1583

ISSN of journal

0018-9383

Year of publication

2011

URL

Number of additional authors

Additional information

Collaborative work with U. Udine and IMEC wherein Warwick performed experimental analysis and modelling of FinFET structures for NXP Semiconductors, subsequently acquired by TSMC which is the main beneficiary of the work. Partly as a result of this work TMSC is going into production with FinFETS from end 2013 (EETimes). It might be expected that some 20% of TMSC's $14B annual revenues will derive from FinFET based technologies within 10yrs.

Interdisciplinary

Cross-referral requested

Research group

None

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract