Output details
15 - General Engineering
University of Warwick
Article title
Si/SiC heterojunctions fabricated by direct wafer bonding
Type
D - Journal article
Title of journal
Electrochemical and Solid State Letters
Article number
-
Volume number
11
Issue number
11
First page of article
H306
ISSN of journal
1099-0062
Year of publication
2008
URL
-
Number of additional authors
8
Additional information
This paper was the result of collaboration with a number of academic and industrial partners including Epitec Limited for the purpose of developing a materials integration system for silicon (Si) and silicon carbide (SiC) heterojunctions. This work was sponsored by the DTI and was known as the “Interactive Research into Silicon Carbide” (INTRINSIC) project. This led to a follow-on meeting with GE regarding applications of wafer bonding, and further development work with Applied Microengineering Limited (contact Tony Rogers: Tony@aml.co.uk).
Interdisciplinary
-
Cross-referral requested
-
Research group
None
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-
