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Output details

13 - Electrical and Electronic Engineering, Metallurgy and Materials

Open University

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Output 50 of 64 in the submission

Article title

Rate-dependent deformation of Sn–3.5Ag lead-free solder

Type

D - Journal article

DOI

10.1007/s10854-008-9830-y

Title of journal

Journal of Materials Science: Materials in Electronics

Article number

Volume number

Issue number

First page of article

1083

ISSN of journal

0957-4522

Year of publication

2009

URL

http://oro.open.ac.uk/16438/

Number of additional authors

Additional information

Since the 2006 EU Waste Electrical and Electronic Equipment and Restriction of Hazardous Substances Directives the addition of lead to most consumer electronics products has been restricted. Here we present data and models for rate-dependent constitutive equations for lead-free solders that are essential for correct modelling of the performance of soldered joints.

Interdisciplinary

Cross-referral requested

Research group

None

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract