Output details
15 - General Engineering
University of Durham
Electrified thin film flow at finite Reynolds number on planar substrates
featuring topography
The methodology/approach reported in the above was incorporated as a novel work package in a case for support, led by the Daresbury Laboratory, submitted to EPSRC’s Collaborative Computational Projects (CCPs) initiative; called CCP12 “High Performance Computing (HPC) in Engineering (EP/J010448/1, 2011-2015), it was funded; the award subsequently received additional monies for Widening Participation Activities directed specifically at related industry/sectors not yet exploiting HPC research facilities. [verification: Prof. David Emerson, STFC Daresbury; david.emerson@stfc.ac.uk]. The associated underpinning solver (FILMPAR; EP/F010745) is available for general download, by the international user community, via the Computer Physics Communications web site: http://cpc.cs.qub.ac.uk/summaries/AEEL_v1_0.html