Output details
15 - General Engineering
Heriot-Watt University (joint submission with University of Edinburgh)
Article title
Accurate temperature monitoring in laser-assisted polymer bonding for MEMS packaging using an embedded microsensor array
Type
D - Journal article
Title of journal
Journal of Microelectromechanical Systems
Article number
5484452
Volume number
19
Issue number
4
First page of article
903
ISSN of journal
1057-7157
Year of publication
2010
URL
-
Number of additional authors
2
Additional information
-
Interdisciplinary
Yes
Cross-referral requested
-
Research group
A - Manufacturing & Materials
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-
