You are in : Home » Results & submissions » Select UOA » 11 - Computer Science and Informatics » View submission: University of Greenwich » Outputs » Detail

Output details

11 - Computer Science and Informatics

University of Greenwich

Return to search Previous output Next output

Output 31 of 48 in the submission

Article title

Modelling methodology for thermal analysis of hot solder dip process

Type

D - Journal article

DOI

10.1016/j.microrel.2013.02.018

Title of journal

Microelectronics Reliability

Article number

Volume number

Issue number

First page of article

1055

ISSN of journal

0026-2714

Year of publication

2013

URL

http://gala.gre.ac.uk/10028/

Number of additional authors

Additional information

Funded through a US Government Grant (H94003-04-D-003-0056/10178928), this is the first time a detailed modelling approach has been developed and validated to identify optimal process conditions for a robotic controlled hot solder dip process that will ensure leaded electronic components are reliable in safety critical applications. Provides our industrial partners with a novel qualification process for these components with potential costs savings of £100,000 per component (Paul Stewart, Lead Engineer, Selex-ES, paul.stewart2@selex-es.com). Work has led onto further grant (H94003-04-D-003-0056/ 10198575) to investigate unleaded components such as ball grid arrays.

Interdisciplinary

Cross-referral requested

Research group

1 - Computational Mechanics & Reliability Group

Citation count

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract