Output details
13 - Electrical and Electronic Engineering, Metallurgy and Materials
University of Greenwich
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Article title
Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
Type
D - Journal article
Title of journal
Microsystem Technologies
Article number
-
Volume number
19
Issue number
6
First page of article
783
ISSN of journal
0946-7076
Year of publication
2013
Number of additional authors
9
Additional information
The output demonstrates flow behaviour of electrolyte in micro-channels, through measurements taken in real-life experiments and complemented by numerical simulations. This is the first time micro-PIV experiments have been compared with Computational Fluid Dynamics (CFD) calculations for flow behaviour in micro-vias structures. The results from the models have helped direct the designs of the micro-vias and design rules from this study have been implemented in industry (Dennis Price, Quality Director, Merlin Circuits, dennis.price@merlincircuit.co.uk).
Interdisciplinary
-
Cross-referral requested
-
Research group
1 - Centre for Numerical Modelling and Process Analysis (CNMPA)
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-
